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CPI's full in-line surface mount (SM) assembly line incorporates the latest advanced technologies in fine pitch placement and is capable of placing the latest generation of fine pitch 0.3mm SM  components such as BGA, µBGA and 0201 packages, in addition to the standard QFP, SOIC, PLCC and TSOP devices.
The Europlacer Finesse2 (EF2) pick and place machine facilitates consistent placement rates by utilizing true on the fly vision and smart nozzles. This is the ultimate in flexibility and productivity. The EF2 can handle a maximum board size of 500mm x 460mm with an optimised placement rate of 14,000 CPH. Parts are held on a fully integrated feeder system which not only eliminates incorrect loading, giving optimum 192 feeder capacity, but also minimises set-ups and gives full material traceability. All SM assembly is carried out in a full ESD protected and climatic controlled environment in line with the CIE IEC 61340-5-1 guidelines. Humidity and Temperature are monitored throughout the process.
The Speedprint SP200avi fully automated screen printer incorporates; full vision alignment, under-stencil clean, laser tool alignment, 2D post print inspection and full SPC data logging, giving optimum process control and minimum machine set-up times.
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